Electronics Forum | Fri Jun 12 14:28:17 EDT 2009 | isd_jwendell
Minimize scavanging by the attached trace and provide more uniform temperatures between all pads.
Electronics Forum | Tue Jun 09 13:16:18 EDT 2009 | jack100
We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines. 1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm wid
Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Sat Oct 07 16:31:56 EDT 2000 | Elfego
Tray the electroform stencil.
Electronics Forum | Sat Oct 07 04:02:50 EDT 2000 | C.J. Long
Good morning, All: I am from PCB shop and one of our customer is experiencing solder bridge on 16 mil pitch QFP( immersion gold finish). Land width requirement is 8 +/- 1 mil measured over top of of land and our mean is 7 mil. Bottom land width is 8
Electronics Forum | Sat Oct 07 11:14:39 EDT 2000 | Aaron
1. It is hard to tell, but your PCB vendor should test the PCB. 2. I think the important thing is the width of the apertures. You should have it laser-cut, and control the width no more than 90% of half pitch. Good luck.
Electronics Forum | Mon Oct 09 19:56:41 EDT 2000 | Dave F
CJ: Arturo and the others make good suggestions. Consider: IPC-7525 Stencil Design Guidelines
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce