Industry Directory: qfn solder void (21)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer of Assembly Equipment / Soldering / OEM

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Precision PCB Services, Inc

Precision PCB Services, Inc

Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider

Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.

New SMT Equipment: qfn solder void (459)

Convection Reflow Oven Mk7

Convection Reflow Oven Mk7

New Equipment | Reflow

Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti

Heller Industries Inc.

DSP787LV Water-Soluble Lead Free Solder Paste

New Equipment | Solder Materials

Qualitek 787LV Lead Free Solder Paste is a VOID-FREE formulation. 787LV is designed for a broad range of SMT applications where water/aqueous post reflow cleaning is required. 787LV can be used for stencil applications. 787LV compliance with ORH1 IP

Qualitek International, Inc.

Electronics Forum: qfn solder void (1025)

IC void

Electronics Forum | Wed Jun 01 23:09:46 EDT 2016 | slouis2014

Hi, can anybody give an idea how to lessen the void on a double ground pad IC. I have tried to change the stencil design, change the solder reflow setting. but i still haven't reach 75% solderability. thanks alot

IC void

Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014

Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul

Used SMT Equipment: qfn solder void (4)

YesTech YTX-X3 3D X-Ray

YesTech YTX-X3 3D X-Ray

Used SMT Equipment | X-Ray Inspection

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Automated Inspection for: Opens & shorts Insufficient / excess solder Lif

Capital Equipment Exchange

CR Tech CRX2000

CR Tech CRX2000

Used SMT Equipment | X-Ray Inspection

CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold

1st Place Machinery Inc.

Industry News: qfn solder void (533)

Seika Releases the Eightech Vacuum Reflow RNV Series in North America

Industry News | 2014-02-28 15:39:33.0

Seika Machinery, Inc.announces the release of the Eightech Vacuum Reflow RNV Series in North America.

Seika Machinery, Inc.

Seika Machinery, Inc.'s SPR Unit Proven to Produce Pure Solder Ingots

Industry News | 2011-10-28 20:59:38.0

Seika Machinery announces that an independent lab has confirmed that its Solder Paste Recycling (SPR) machine is capable of producing pure solder ingots from solder paste.

Seika Machinery, Inc.

Parts & Supplies: qfn solder void (1)

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

Technical Library: qfn solder void (228)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Videos: qfn solder void (95)

Solder Paste capabilities with the SV-100 Slider Valve

Solder Paste capabilities with the SV-100 Slider Valve

Videos

Dispensing dots, lines and into recessed cavities. Video was shot with a lipstick camera mounted to the dispense head. http://www.nordsonasymtek.com

Nordson ASYMTEK

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

Videos

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Automated Inspection for: Opens & shorts Insufficient / excess solder Lif

Capital Equipment Exchange

Training Courses: qfn solder void (15)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: qfn solder void (63)

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Surface Mount Technology Association (SMTA)

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Surface Mount Technology Association (SMTA)

Career Center - Resumes: qfn solder void (5)

SMT Process Engineer

Career Center | Fremont, California USA | Engineering,Production

4 years of PCB assembly process.

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Express Newsletter: qfn solder void (907)

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

Partner Websites: qfn solder void (495)

Reflow Techniques for Void Reduction. - Heller Industries

Heller Industries Inc. | https://hellerindustries.com/bit_publications/reflow-techniques-for-void-reduction/

Component Cracking Intermetallic Growth on PCB Dull solder joints ×   Reflow Techniques for Void Reduction. Post navigation Previous Post Previous The Last Will And Testament of the BGA Void

Heller Industries Inc.

Solder Selection Guide

Nordson ASYMTEK | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

) and MicroBGA often call for voiding under 20%. A low-void solder paste is required to meet the very low-voiding limits for Class 3 assemblies

Nordson ASYMTEK


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World's Best Reflow Oven Customizable for Unique Applications
Precision Auger Dispense Pump

Easily dispense fine pitch components with ±25µm positioning accuracy.
Panasonic AM100

Orange Sticks, Wiring Aids & Probes for Soldering & Desoldering.
vision placer pnp creator

Best Reflow Oven


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