Industry Directory: qfn thermal pad solder paste (4)

EasyBraid Co.

EasyBraid Co.

Industry Directory | Manufacturer of Assembly Equipment / Repair / Rework / Soldering

A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.

VisionMaster, Inc.

VisionMaster, Inc.

Industry Directory | Inspection

VisionMaster is the original longtime manufacturer of advanced yet affordable 3-D solder paste inspection (SPI) equipment. VisionMaster provides best-in-class 3D white light technology and repeatability at laser technology prices.

New SMT Equipment: qfn thermal pad solder paste (106)

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

New Equipment | Solder Materials

DSP 825HF is a lead-free, no clean, halogen-free solder paste designed specifically for a wide range of lead-free alloys. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow process windows combine

Qualitek International, Inc.

PCB Library Expert - Tens of Millions of FREE Parts, 25 CAD Formats!

PCB Library Expert - Tens of Millions of FREE Parts, 25 CAD Formats!

New Equipment | Software

The PCB Library Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts footp

PCB Libraries, Inc.

Electronics Forum: qfn thermal pad solder paste (223)

Solder short-BGA with thermal pad

Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran

Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.

Solder short-BGA with thermal pad

Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef

Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta

Industry News: qfn thermal pad solder paste (98)

SMTA International to Address QFN Assembly & Reliability

Industry News | 2011-09-14 12:04:43.0

The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.

Surface Mount Technology Association (SMTA)

Kyzen’s Mike Bixenman to Hold Cleaning for QFN Rework Presentation at SMTAI 2009

Industry News | 2009-09-17 14:28:17.0

NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

KYZEN Corporation

Technical Library: qfn thermal pad solder paste (201)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Videos: qfn thermal pad solder paste (11)

PCB Library Expert

PCB Library Expert

Videos

The PCB Library Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts footp

PCB Libraries, Inc.

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

Training Courses: qfn thermal pad solder paste (3)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: qfn thermal pad solder paste (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Resumes: qfn thermal pad solder paste (3)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: qfn thermal pad solder paste (910)

SMTnet Express - June 11, 2015

SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC

Voiding Control for QFN Assembly

Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size

Partner Websites: qfn thermal pad solder paste (174)

Solder Pin In Paste

GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-pininpaste.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER

GPD Global

AIM Solder

| http://kvms.be/aim-solder.php

  solder paste, liquid flux, cored wire, bar solder and more, on a global scale. M8 No Clean Solder Paste M8 NO CLEAN SOLDER PASTE is designed for the most demanding high density electronic assemblies


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