New Equipment | Tape and Reel Services
We offer tape and reel packaging services for standard or non standard SMD components. We provide as well customized carrier tapes for special components designed at our customers specifications Standard components: DDPAK DPAK SOP PLCC QFP QFN TO25
New Equipment | Test Equipment
M8192A Main features Up to 6 M8190A AWG modules or 12 independent channels to generate complex signal scenarios Up to 4 M8051A and 1 M8041A BERT modules, or 10 independent channelsPrice vary with options. Feel free to contact me for more details
Electronics Forum | Thu Mar 02 18:30:38 EST 2006 | jhune
is there a posibilities that a lead solder sticked on the pot can be absorbed by a potato when you placed it on the solder pot. to be able to use the pot for leadfree solder.
Electronics Forum | Thu Mar 02 20:21:49 EST 2006 | slthomas
No, but I'm sure the Potato Board of the State of Idaho would love to help you promote that idea. It might even help keep the spud on their license plates.
Industry News | 2023-08-12 13:48:10.0
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main methods to improve the speed of the SMT machine:
Industry News | 2019-06-26 19:59:58.0
IPC’s Emerging Engineer program provides professionals early in their careers an opportunity to learn from industry mentors about IPC Standards development, and to obtain education and training for professional development. IPC is now actively seeking applications for engineers and mentors for the 2020 Emerging Engineer program.
Technical Library | 2007-05-17 16:44:37.0
In the quest for quality, selecting the right Statistical Process Control (SPC) Software system doesn't boil down to a simple functional "fit-to-requirements" anymore. Once the expert domain of highly focused, independent software developers, the competitive landscape has changed dramatically with the influx of big-name ERP software providers who are aggressively promoting integrated quality modules within an all-encompassing business application framework.
Technical Library | 2017-03-22 20:58:08.0
Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
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. During QFP analysis, for example, the rotational acc
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
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