Industry Directory: qsp-2 vacuum failure (1)

Mat-tech

Industry Directory | Consultant / Service Provider / Manufacturer

Mat-tech is your specialist in high-tech soldering & brazing. Whether it's developing a new product or improving an existing product, we provide the perfect joint.

New SMT Equipment: qsp-2 vacuum failure (462)

Asscon VP2000 with vacuum

Asscon VP2000 with vacuum

New Equipment | Reflow

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces

A-Tek Systems Group LLC

Minilock-Phantom - Reactive Ion Etcher (RIE) with a Vacuum Loadlock

Minilock-Phantom - Reactive Ion Etcher (RIE) with a Vacuum Loadlock

New Equipment | Surface Finish

The Minilock-Phantom is the first RIE system in the industry to incorporate a vacuum load-lock on a compact platform. The system has been designed to meet all the safety and equipment needs for the most challenging processes including etch applicatio

Trion Technology

Electronics Forum: qsp-2 vacuum failure (35)

Timeout waiting for nozzle changer vacuum buildup.

Electronics Forum | Fri Sep 01 09:54:02 EDT 2017 | gsmx4321

I get a Timeout waiting for nozzle changer vacuum buildup failure every time I go to run my 1998 GSMx machine. The problems seems to be that once in a while (it seems to be random) the spindle does not line up exactly in the center of the nozzle cha

Mydata TP11 UFP hardware initiation failure

Electronics Forum | Wed Jul 26 16:08:29 EDT 2006 | ev

My focus has moved to the X motor itself. The one common factor in this paricular problem has been the time of year. The day was a particularly hot day with high humidity. Even though there is a "Xfan" connection on the PIAB board I do not believe th

Used SMT Equipment: qsp-2 vacuum failure (2)

CR Tech RTI 6520

CR Tech RTI 6520

Used SMT Equipment | AOI / Automated Optical Inspection

We have a Very nice CR Technology AOI Machine For Sale. Machine has been powered up and is in Good Working Condition. Included is a copy of the software CD and Manual for the machine. See attached pictures and information belo

1st Place Machinery Inc.

DEK automatic solder paste printing machine

DEK automatic solder paste printing machine

Used SMT Equipment | Pick and Place/Feeders

DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde

KingFei SMT Tech

Industry News: qsp-2 vacuum failure (17)

Count On Tools Introduces Quad 8mm Feeder Peel Roller

Industry News | 2010-07-20 13:41:03.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its new Quad 8mm Feeder Peel Roller (Blue Urethane), OEM PN# 30-15495 (Tyco #4-1567056-3).

Count On Tools, Inc.

Count On Tools Expands Its Quad Feeder Peel Roller Series

Industry News | 2011-04-20 15:54:05.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, has expanded its line of Quad Feeder Peel Rollers.

Count On Tools, Inc.

Parts & Supplies: qsp-2 vacuum failure (2)

Panasonic KXFW1KS6A00 CM402 12mm feeder for SMT Machine

Panasonic KXFW1KS6A00 CM402 12mm feeder for SMT Machine

Parts & Supplies | Pick and Place/Feeders

1 KXFE00F3A00 CPU board (CPU card ) N610087118AA (SCV1ER) 2 KXFY001LA00 RING I / O BOARD ( around the I / O card ) KXFE000FA00 (NFV2CD) 3 KXFE0005A00 ONE BOARD MICROCOMPUTER ( head of I / O cards ) MC16/H3 N610090171AA 4 KXFE0004A00 PC BOARD W / C

KingFei SMT Tech

Panasonic VALVE

Panasonic VALVE

Parts & Supplies | SMT Equipment

  N610073252AA Main Body:NPM 1043889510AA ADJUST BOLT N610084824AA Label(Main Body):NPM N610073372AA Main Body (H):NPM N610073583AA CPU BOX & Wiring:NPM N610058919AM POWER UNIT:NPM N610087627AA Operation parts (H):NPM N610052923AA X-Axis:NP

Qinyi Electronics Co.,Ltd

Technical Library: qsp-2 vacuum failure (2)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Maximal Performance Through Vacuum Potting

Technical Library | 2021-07-28 18:35:13.0

The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of.

Scheugenpflug Inc.

Videos: qsp-2 vacuum failure (3)

ASSCON VP2000 Vapor-Phase Soldering Machine

ASSCON VP2000 Vapor-Phase Soldering Machine

Videos

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces

A-Tek Systems Group LLC

Cartridge Material Feeder

Cartridge Material Feeder

Videos

Up to 90 Percent Less Material Waste per Cartridge Change Scheugenpflug has further developed the proven material feeding unit for dispensing applications with high viscosity materials and low media consumption: The new A90 CV not only ensures a pro

Scheugenpflug Inc.

Events Calendar: qsp-2 vacuum failure (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: qsp-2 vacuum failure (1)

Thin Film Sputtering Engineer

Career Center | Corpus Christi, Texas USA | Engineering,Production

Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th

DWA Global Search

Career Center - Resumes: qsp-2 vacuum failure (2)

SMT ENGINEER/TECHNICIAN

Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support

Experience SMT machine maintenance and SMT process from raw materials to finish goods

Sr. Sales & Application Engineer- SMT Field Service Engineer

Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support

Some key points you may find relevant to this job opportunity include:     Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments.     Provide solution to custom

Express Newsletter: qsp-2 vacuum failure (520)

Partner Websites: qsp-2 vacuum failure (91)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. The vacuum reflow chamber IR Panel heater was set to 300 °C for this process. Table 2. Convection reflow heat zone set points for the re- assembly reflow process. Zone Top (oC) Bottom (oC) Zone Top (oC) Bottom (oC

Heller 公司

Count On Tools 2010-0773

| https://pcbasupplies.com/seoul-p4-led-nozzle-for-quad-qsp-with-plastic-tip-2010-0773/

» SMT Custom Nozzles » Other LEDs » Seoul P4 LED Nozzle for Quad QSP with plastic tip [2010-0773] Seoul P4 LED Nozzle for Quad QSP with plastic tip [2010-0773


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