SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Special Announcements Georgia Institute of Technology and SMTnet Forge B2E Alliance Featured Articles Stencil Design Stencil Design
The Reliability Challenges of QFN Packaging The Reliability Challenges of QFN Packaging The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages
