Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Mon Apr 16 13:31:36 EDT 2012 | jdengler
Have you tried to restart F4G and/or MCS/30 after flushing the CP4 memory? I have occasionally ran into the comm error after a reset start. Leave the machine on and restart F4G or the MCS/30 whichever normally is hooked up. If it still won't commu
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
!! NEW: Added an error message when the SOP body width is less than 3.0 mm New 3D Component families added - Oscillator, J-Lead - Oscillator, L-Bend - Quad Flat No-Lead (QFN
ACI Technologies, Inc Preparation for Reflow Profiling Preparation is the key for successful lead-free reflow profiling. There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs