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Electronics Forum | Mon Oct 09 07:50:22 EDT 2006 | quad
We currently run two Quad IVC's (we are very pleased with them) and two Versatronics for simple small volume batch work. We now need an additional machine capable of placing components at least three times as quickly as a IVC. We don't do anything ve
Quad QSX-1 IBE SMT Inventory ID : 150406-001 Quad Serial Number : 3389 Details QSoft-2 Version 1.3.27 QuadAlign Version 4.50 Windows 98 O/S Click Here for more details or to request a quote online... IBE SMT Equipment 281-259
Industry News | 2016-08-29 18:31:30.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.
Industry News | 2013-06-24 17:06:39.0
ZESTRON, is pleased to announce that Jigar Patel, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Determine Critical Cleaning Process Parameters for QFNs” at the SMTA Upper Midwest Expo and Tech Forum on June 27th.
Detailed Product Description Part Name: Backup Pin Part Number: J7500003B Color: Black Material: Plastic Nature: Magnetic Usage: Samsung CP45NEO CP45FV SM421 Machine Backup Pin J7500003B For CP45FV NEO/SM421/411/321 Machine PCB Suport Pin Des
Detailed Product Description Brand: Samsung Part Name: Power Supply Model: STW400-24 Machine Model: SM482 Condition: Original Used Location: Shenzhen STW400-24 Power Supply For Samsung SM482 Surface Machine Original Used Description: 1, Bra
Technical Library | 2012-11-21 18:57:58.0
The continuing evolution toward advanced miniature packaging has led to ever increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is an ever increasing probability for defects to occur on finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder, and solder bridges; there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded device, BGA and LED packages.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
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