New SMT Equipment: quad and qsa-30 (21)

Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI

New Equipment | Inspection

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

Machine Vision Products, Inc

Electronics Forum: quad and qsa-30 (141)

Advice on used pick and place machine

Electronics Forum | Mon Oct 09 07:50:22 EDT 2006 | quad

We currently run two Quad IVC's (we are very pleased with them) and two Versatronics for simple small volume batch work. We now need an additional machine capable of placing components at least three times as quickly as a IVC. We don't do anything ve

QUAD QSA-30

Electronics Forum | Wed Jun 30 17:49:23 EDT 2004 | jsloot

Is anyone able to tell me where in this world I can get a downloadable copy of the MMI (man machine interface) software for a QUAD QSA-30? Version of software needed is 5.400

Used SMT Equipment: quad and qsa-30 (11)

Samsung QSA-30

Samsung QSA-30

Used SMT Equipment | Pick and Place/Feeders

Samsung / Quad Corp Quad QSA-30 SMT Pick& Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80006 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement

Baja Bid

Samsung QSA-30A

Samsung QSA-30A

Used SMT Equipment | Pick and Place/Feeders

Samsung / Quad Corp Quad QSA-30A SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80122 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement

Baja Bid

Industry News: quad and qsa-30 (64)

MIRTEC to Exhibit Its Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2016

Industry News | 2016-08-29 18:31:30.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.

MIRTEC Corp

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

Parts & Supplies: quad and qsa-30 (12)

Quad/Samsung Dynatech QSA30, card part # 3-1567157-3

Parts & Supplies | Pick and Place/Feeders

Need a IO/DPRAM card at the QSA-30's VME rack. Must be a working card.

Niche Technology, Inc.

Samsung EF Cylinder MBDA16X5

Parts & Supplies | Pick and Place/Feeders

We need price and delivery for this Cylinder, comes from a QUAD QSA 30 (made by Samsung). Tyco/Quad partnumber 4-156-7320-0 Samsung partnumber 1301214

KVMS SMT Equipment Services Supplies

Technical Library: quad and qsa-30 (2)

Solder Paste Stencil Design for Optimal QFN Yield and Reliability

Technical Library | 2015-06-11 21:20:29.0

The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements

Lockheed Martin Corporation

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Technical Library | 2023-09-18 14:10:01.0

As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.

NASA Office Of Safety And Mission Assurance

Videos: quad and qsa-30 (17)

Quad QSA-30

Videos

Our QSA-30 Pick and Place machines are returned to like new condition by factory trained engineers. These systems are completely rebuilt to include new P4 computers, Hard Drives, Keyboards, Monitors, and a Trackball Mouse. The sheet metal covers are

Automation Technical Services

Quad QSV-1 Pick and Place - IBE ID: 131206-003

Quad QSV-1 Pick and Place - IBE ID: 131206-003

Videos

Quad Placement System at IBE SMT Equipment More details here: http://www.ibesmt.com/Quad_QSV-1_Pick_Place/Flexible_Placers/3413/SMT.aspx

IBE SMT Equipment

Express Newsletter: quad and qsa-30 (202)

Partner Websites: quad and qsa-30 (159)

Quad - PPM

| https://pcbasupplies.com/quad-ppm/page/2/

» SMT Standard Nozzles » Quad - PPM » Page 2 Quad - PPM Feeder Rollers Other Consumables Z-Rods & Nozzles Showing 13–24 of 30 results ` Default sorting Sort by popularity Sort by latest Sort by price

The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218

: SMTA International Abstract:  The Pb-free solder joint attachment reliability of two Quad Flat No-Lead (QFN) packages with different body sizes and die to package ratios (DPR

Surface Mount Technology Association (SMTA)


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