Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2010-12-03 21:35:04.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Industry News | 2021-06-16 10:54:26.0
XJTAG®, a leader in JTAG boundary scan test solutions, announces the introduction of Serial Wire Debug (SWD) support, user-defined libraries, a new clock generator, and other benefits in its latest software release, XJTAG 3.11.