New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Electronics Forum | Fri Mar 23 07:39:34 EDT 2007 | namruht
I have tried to teach the part a couple of different ways. I have the component taught as a Quad Flat Pack and I am ignoring two of the sides. This has provided better results but still not consistent.
Electronics Forum | Tue Oct 29 14:24:24 EST 2002 | genny
SOP small outline package SOIC small outline integrated circuit TSOP thin SOP TSSOP thin shrink SOP PQFP plastic quad flat pack (also CQFP is ceramic QFP) LQFP low profile QFP VQFP I don't know QSOP a guess is 'quad small outline pkg'
Used SMT Equipment | Repair/Rework
SRT Sierra Summit 1100 HR Rework Station. Particularly suited for BGA's and very fine pitch leaded components as quad flat packs (QFP).MS Windows based software
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Parts & Supplies | ESD Control Supplies
556-07-155 SWING ARM UNIT for TDK Auto Insertion Machines Spare Parts 615-00-135 CYLINDER 615-00-143 CYLINDER 615-00-147 CYLINDER 615-00-202 CYLINDER 615-00-381 CYLINDER 615-00-452 CYLINDER 615-00-573 CYLINDER 615-00-580 CYLINDER
Parts & Supplies | Pick and Place/Feeders
N510028418AA SENSOR EE-SX910-C2J-R 0.5M N610069934AA トレイフィーダ引出部:NPM Tray Feeder Drawing-out Section:NPM N210097292AC BLOCK 0 N610136671AA 全体カバー:NPM-D Whole Cover:NPM-D N610110951AE X-PLATE(F) 0 N210068065AA SPRING 0 N510026562AA WASHER MMSRB6-0
Technical Library | 2011-10-27 18:03:53.0
Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row
Technical Library | 2010-05-27 22:12:10.0
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
The Reliability Challenges of QFN Packaging The Reliability Challenges of QFN Packaging The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages
| https://pcbasupplies.com/anti-static-1/
Tip Cutters Pliers Bent Nose Pliers Chain Nose Pliers Flat Nose Pliers Jewelry Making Pliers Needle Nose Pliers Round Nose Pliers Tweezers Accessories Cutting Tweezers Mini Tweezers Precision
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/advanced-features/time-domain-imaging
Time Domain Imaging (TDI)™ After the VRM data has been collected, time domain images can be created from the archived data. The images shown were created in this manner on a QFP (Quad Flat Pack
