Overview • Almost 60 times faster than the original 80C51 • Almost 5 times faster than 80C251 - at the same frequency • Quad-Pipelined architecture DQ80251 is a revolutionary Quad-Pipelined ultra high performance, speed optimized soft cor
Overview • Almost 30. times faster than 80C51 • Quad-Pipelined architecture • 24 times faster multiplication (12 times division) DQ8051XP is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded control-ler, de
Quad IV C There are 2 units in the inline configuration. one with a matrix tray feeder. together these units hold up to 136 feeders and a synchronized to run in line. The Quad IV C is a reliable and proven platform with inexpensive feeders available.
Industry News | 2017-08-23 11:13:41.0
Versatile Raspberry Pi-based ComfilePi models CPi-A070WR and CPi-A102WR are housed and adapted for industrial use
Industry News | 2014-09-17 10:42:30.0
JTAG Technologies is showcasing amongst other products the new JTAG/boundary-scan hardware interface product compatible with the Virginia Panel (VPC) mass interconnect system.
Detailed Product Description Part Name: Backup Pin Part Number: J7500003B Color: Black Material: Plastic Nature: Magnetic Usage: Samsung CP45NEO CP45FV SM421 Machine Backup Pin J7500003B For CP45FV NEO/SM421/411/321 Machine PCB Suport Pin Des
Detailed Product Description Brand: Panasonic Model: MSMA152A1C Name: AC Servo Motor Input: 200V Current: 9.4A Output: 1.5KW 1500W AC Servo Motor MSMA152A1C For Samsung CP45 Surface Mount Machine Detail Information: 1, Part Name: AC Servo M
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."