Industry News | 2016-12-05 19:15:04.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that EIT, LLC, a High-Tech Electronic Manufacturing Services (EMS) company specializing in high-quality manufacturing and box-build assemblies, has selected MIRTEC’s MV-6 OMNI 3D AOI Machine based on outstanding performance and 3D defect detection capability.
Industry News | 2001-12-14 15:08:35.0
Avail. for ordering at Dynamic Engineering
Industry News | 2020-11-19 11:25:25.0
Manual testing can take up most of a technician's time. The solution to the problem can be auto-mated testing using signature analysis systems. However, even here you can face the problem of lack of documentation for the board. This problem is not acute if there is documentation or if we are talking about new boards, the documentation for which is publicly available. However, what if the boards have been produced for a long time, and the documentation has been lost? In this case, intelligent recognition systems can help, which will allow you to identify component pins without documentation for the board. In this article we will show you how easy and fast it is possible thanks to our EyePoint p10 and EyePoint S2 systems, using the STM32F429 board as an example.
Industry News | 2014-06-27 19:17:55.0
ADLINK Technology announced the release of its powerful, new generation x86 smart camera, NEON-1040, featuring the quad core Intel® Atom™ processor E3845 1.9 GHz, 2048 x 2048 pixels @ 60 fps 1" monochrome CMOS global shutter image sensor, and PWM lighting control support.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2015-08-18 14:11:22.0
Advanced technology compact PC controller is ideal for fit-and-forget installations.
Industry News | 2013-04-11 18:53:28.0
Multitest, will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
Industry News | 2018-10-02 12:29:44.0
ADLINK announces the addition of the quad-core Intel® Core™ i3-8100H processor to its recently released Express-CF COM Express Basic size Type 6 module based on the 8th Generation Intel® Core™ i5/i7 and Xeon® processors (formerly Coffee Lake).
Industry News | 2016-09-05 20:16:54.0
JTAG Technologies will demonstrate amongst other new boundary scan solutions:
