THE HOTFLOW SERIES: INDIVIDUALLY TAILORED TO YOUR NEEDS. Outstanding thermal performance, highest machine uptime and lowest operating costs have been the convincing advantages of Ersa reflow soldering systems for many years already. The HOTFLOW 3
Electronics Forum | Fri Oct 27 09:42:12 EDT 2000 | Daniel Carlsson
I wonder if anyone have experience from using a fairly new reflow oven and would like to share your toughts (advantages or disadvantages) with me. I�m especially interested in: Conceptronic, Electrovert, ERSA, Heller, Quad, Rehm, Seho, SMT or Vitroni
Industry News | 2007-11-04 19:49:02.0
DORSET, UNITED KINGDOM - DATE, 2007 - Blakell Europlacer, the UK distributor and owner of innovative manufacturers Europlacer and Speedprint, announces the appointment of Andy Jones as UK General Sales Manager effective from 2nd January 2008.
Industry News | 2015-09-21 11:39:28.0
EMS provider Season Group in Texas is continually upgrading their manufacturing capabilities. As part of this process; they will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on October 5, 2015 and the closing will begin at 11:00am EST on October 6, 2015.
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Precision Placement Machines is a full service supplier for the circuit board assembly industry. We specialize in Quad pick & place, MPM screen printers, Heller reflow ovens and Camalot dispesers. Visit us online at www.goppm.com
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
The Reliability Challenges of QFN Packaging The Reliability Challenges of QFN Packaging The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages