Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).
Our products include custom-made parts made of the following materials and fabricated to your specifications. AC 998 Aluminum Oxide Quartz Sapphire Silicon 99.5% Aluminum Oxide Aluminum 6061 Aluminum Nitride Celazole Graphite Macor Pyrex Silicon C
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
Electronics Forum | Fri Nov 07 15:05:16 EST 2003 | stefwitt
It was not stolen, it was disposed Cookson profits from cost-cutting Electronics and ceramics group Cookson has taken heart from half-year results as all three of its divisions kept out of the red in the second quarter. The group says a recent co
Electronics Forum | Tue May 25 12:43:00 EDT 2010 | jmedernach
I don't have experience with 1B73. I do have a ton of experience with CE-1155. There are a couple of gotchas with this material. First and foremost is that it HATES silicone residue. If the material is not sticking to parts and they aren't cerami
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
· Dual Magnification, auto-focusing Optical System · DC brushless, 60,000 RPM closed-loop speed-controlled Air Bearing Spindle · Front loaded dual Cassette Compartment · Inspection Drawer - also used for single wafer load/unload · Dress Wafe
Industry News | 2017-10-15 17:46:51.0
Metcal today announced the introduction of its new HCT2-200 Digital Hot Air Pencil. The HCT2-200 is the latest addition to Metcal’s line of convection rework tools. This digital handheld convection tool is designed for use in light rework applications that use smaller components and integrated circuits.
M421 SM321 Solenoid Valve VA01PEP34B-1U DC24V SM421 SM321 Solenoid Valve VA01PEP34B-1U DC24V 1. SMT Nozzles: CP33, CP40, CP45, CP33, CP45: TN030 Nozzle/TN040 Nozzle/TN065 Nozzle/TN14 Nozzle/TN22 Nozzle/TN40 Nozzle/TN75 Nozzle/TN110 Nozzle/CN030
J90831069C CP1_TB1_MC1_CABLE_ASSY J90831071C MC1_PS3_PS4_CABLE_ASSY SM33-PW009 J90831082C PS1_1_DC_POWER_BD_CABLE_ASSY J90831083D PS1_2_DC_POWER_BD_CABLE_ASSY J90831085B FZ1-FZ6_DC24V_POWER_CABLE_ASSY SM33-PW02 J90831086A RZ1-RZ6_DC24V_POWER_CAB
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is
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. They can be one-quarter to even one-tenth of the size and weight of a leaded component. Since SMT components are attached using small solder joints, they must be small and lightweight