Industry Directory: quarterly ceramic silicon (9)

Applied Ceramics

Industry Directory |

Applied Ceramics is a fabricator of custom-made ceramics, quartz, silicon and sapphire spare parts designed for the semiconductor industry.

Precision Engineered Ceramics, Inc.

Industry Directory |

Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).

New SMT Equipment: quarterly ceramic silicon (110)

Applied Ceramics' Products

Applied Ceramics' Products

New Equipment |  

Our products include custom-made parts made of the following materials and fabricated to your specifications. AC 998 Aluminum Oxide Quartz Sapphire Silicon 99.5% Aluminum Oxide Aluminum 6061 Aluminum Nitride Celazole Graphite Macor Pyrex Silicon C

Applied Ceramics

Direct Die Attachment

Direct Die Attachment

New Equipment | Assembly Services

Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati

S-Bond Technologies

Electronics Forum: quarterly ceramic silicon (7)

speedline sale

Electronics Forum | Fri Nov 07 15:05:16 EST 2003 | stefwitt

It was not stolen, it was disposed Cookson profits from cost-cutting Electronics and ceramics group Cookson has taken heart from half-year results as all three of its divisions kept out of the red in the second quarter. The group says a recent co

Help with dewetting

Electronics Forum | Tue May 25 12:43:00 EDT 2010 | jmedernach

I don't have experience with 1B73. I do have a ton of experience with CE-1155. There are a couple of gotchas with this material. First and foremost is that it HATES silicone residue. If the material is not sticking to parts and they aren't cerami

Used SMT Equipment: quarterly ceramic silicon (2)

Universal Instruments GSMxs SMT Pick & Place

Universal Instruments GSMxs SMT Pick & Place

Used SMT Equipment | Pick and Place/Feeders

Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com

Capital Equipment Exchange

Kulicke&Soffa Industries 7500

Kulicke&Soffa Industries 7500

Used SMT Equipment | Semiconductor & Solar

·  Dual Magnification, auto-focusing Optical System ·  DC brushless, 60,000 RPM closed-loop speed-controlled Air Bearing Spindle ·  Front loaded dual Cassette Compartment ·  Inspection Drawer - also used for single wafer load/unload ·  Dress Wafe

LEL Tech

Industry News: quarterly ceramic silicon (29)

2-Part Mixing is now Volumetric Dispensing!

Industry News | 2017-06-14 10:46:29.0

GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.

GPD Global

Metcal Introduces Digital Hot Air Pencil for Light Rework Applications

Industry News | 2017-10-15 17:46:51.0

Metcal today announced the introduction of its new HCT2-200 Digital Hot Air Pencil. The HCT2-200 is the latest addition to Metcal’s line of convection rework tools. This digital handheld convection tool is designed for use in light rework applications that use smaller components and integrated circuits.


Parts & Supplies: quarterly ceramic silicon (35)

Samsung SM421 SM321 Solenoid Valve VA01PEP34B-1U DC24V

Samsung SM421 SM321 Solenoid Valve VA01PEP34B-1U DC24V

Parts & Supplies | Assembly Accessories

M421 SM321 Solenoid Valve VA01PEP34B-1U DC24V SM421 SM321 Solenoid Valve VA01PEP34B-1U DC24V 1. SMT Nozzles: CP33, CP40, CP45, CP33, CP45: TN030 Nozzle/TN040 Nozzle/TN065 Nozzle/TN14 Nozzle/TN22 Nozzle/TN40 Nozzle/TN75 Nozzle/TN110 Nozzle/CN030

KingFei SMT Tech

Samsung SAMSUNG NOZZLE CN040 J90550134C

Samsung SAMSUNG NOZZLE CN040 J90550134C

Parts & Supplies | SMT Equipment


Qinyi Electronics Co.,Ltd

Technical Library: quarterly ceramic silicon (1)

Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?

Technical Library | 2019-09-24 15:41:53.0

This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.

Lackwerke Peters GmbH + Co KG

Videos: quarterly ceramic silicon (4)

Spectrum II - Solder Paste Dots & Lines

Spectrum II - Solder Paste Dots & Lines


With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su

ASYMTEK Products | Nordson Electronics Solutions

Leading Industry in Nashik For Resistance Welding Consumables, WeldParts

Leading Industry in Nashik For Resistance Welding Consumables, WeldParts


Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is

Paramount Enterprises

Events Calendar: quarterly ceramic silicon (2)

SMTA Silicon Valley Expo & Tech Forum

Events Calendar | Wed Dec 04 00:00:00 EST 2019 - Wed Dec 04 00:00:00 EST 2019 | San Jose, California USA

SMTA Silicon Valley Expo & Tech Forum

Surface Mount Technology Association (SMTA)

Post – Moore's Law Electronics: From Now until Quantum Computing

Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,

Post – Moore's Law Electronics: From Now until Quantum Computing

Surface Mount Technology Association (SMTA)

Career Center - Jobs: quarterly ceramic silicon (1)

Sales: Account Executive

Career Center | , USA | Sales/Marketing

Silicon Forest Electronics is looking for an Outside Account Executive. This is a company that is financially solid, growing rapidly and has even stronger future growth prospects. It is also a company that values its employees and fosters a team-orie

Silicon Forest Electronics

Career Center - Resumes: quarterly ceramic silicon (2)


Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Quality Control/Production and Management

Career Center | Melbourne, Florida USA | Management,Production,Quality Control

Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude

Express Newsletter: quarterly ceramic silicon (122)

Partner Websites: quarterly ceramic silicon (27)

Manufacturing Fuel Cell Manhattan Project (Hardcover)


(MEA) Bipolar Plates Proposed Projects for Polymer Electrolyte Membrane Fuel Cells Ceramic Fuel Cells Planar SOFCs Tubular Fuel Cells Proposed Projects for Ceramic Fuel Cells Balance of Plant Reactant

LED Industry - Dongguan Intercontinental Technology Co.,Ltd.


: 0      Author:Site Editor     Publish Time: 2021-01-15      Origin: Site Industry Introduction LED flip chip refers to the chip that can be directly bonded with ceramic substrate without welding wire. We call it DA chip

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