Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Mon Feb 28 23:07:04 EST 2011 | kemasta
It is random. By the way, this board pass thought wave process, (BGA is at the top), will that cause the older short issue?
Electronics Forum | Fri Feb 25 09:30:29 EST 2011 | kahrpr
Was the void on the same pad for the 5 failures or were they random
Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang
OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did
Electronics Forum | Tue Sep 14 02:12:22 EDT 2010 | genesan
Hi Sir, Thanks for reply and base on our system the same part are using for 2 model only and the problem occur on both assembly.By the way as feedback it happen on random pin of this BGA only.
Electronics Forum | Tue Jun 16 14:26:41 EDT 2020 | rsatmech
Hello all, I am randomly getting solder short due to voids in the BGA Reference image attached. Kindly provide your thoughts on this as how to approach to resolve this issue.
Electronics Forum | Thu Dec 15 09:05:44 EST 2005 | russ
These random shorts, are they most prevailent on the edges, corners, or truly all over the place. It almost sounds like package warp/delamination or something of that nature. Are you baking parts per MSL requirements?
Electronics Forum | Wed Jun 17 15:20:18 EDT 2020 | rsatmech
Thank you for your valuable inputs. Current two SMT line is running and I have initiated to use two different pcb suppliers in each line. Do I need to check the plating details in issue pcba or random pcb. Kindly suggest.
Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9
Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials
Electronics Forum | Tue Sep 14 00:22:08 EDT 2010 | sachu_70
Hi Gani, non-wettting issues can surely be resolved. At first, would appreciate if the following info could be shared. Do you supply just one PCBA product to this client or is the complaint towards one of the many products that you deliver? Also, doe
