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New Equipment | Industrial Automation
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Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
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: #V is co m _S 30 16 _u lt ra _E N _L ET 20 06 00 02 Su b je ct t o t ec h n ic al c h an g es . W in d o w s® a n d In te l® C o re ™ i7 a re r eg is te re d t ra d em ar ks
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, °C Pe rc en t o f r oo m te m pe ra tu re v al ue Dielectric constant (60 Hz) Dielectric strength 1) ASTM D-149 using 50 mm (2 inches) electrodes, rapid rise
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