Industry Directory: reaction (4)

Hemeixin Electronics Co., Ltd

Industry Directory | Manufacturer of Bare PCBs

Hemeixin specializes in PCB fabrication for 14 years, with the strength of quick reaction, with good quality and pretty competitive price.

Steiner Elektronik Ltd.

Industry Directory | Manufacturer of Assembled PCBs / Assembly / Pick and Place / Soldering

Steiner Elektronik provides high quality tested PCBs, PCB assembly, provision of electronic components, potting and cable confection. ESD protected environment according to ISO 9001 and ISO 14001.

New SMT Equipment: reaction (291)

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Time Rapid Prototyping Solutions Ltd

New Equipment |  

We offer various services ranging from SLA, FDM, SLS, Investment and Wax Casting, Tooling Reaction Injection Moulding, Vacuum Casting, Modelling, Rotational Moulding and Pattern Making. We also offer a complete design package taking concept through

Time Rapid Prototyping Solutions Ltd

Electronics Forum: reaction (193)

Strange reaction with Selective Solder alloy

Electronics Forum | Tue Apr 05 19:29:51 EDT 2022 | proceng1

This flux is used to clean nozzles. It's not applied directly to the board.

Strange reaction with Selective Solder alloy

Electronics Forum | Wed Apr 06 10:48:01 EDT 2022 | dontfeedphils

Why not just switch back to Superior 75? Why switch in the first place?

Used SMT Equipment: reaction (3)

Heller 1088EXL

Heller 1088EXL

Used SMT Equipment | Soldering - Reflow

Hello and thank you for your interest in our Heller 1088EXL Reflow Oven. See attached pictures and information Heller Reflow Oven Model Number: 1088EXL Serial Number: 0201DA1A1-53956 Year: Feb 2001 Left to Right Process Flow 8 heating zone for

1st Place Machinery Inc.

Nordson MARCH AP-300

Nordson MARCH AP-300

Used SMT Equipment | Semiconductor & Solar

Nordson MARCH AP-300 Plasma System Cleaner 100-230VAC, 50/60Hz, 3.5A @208V, Single Phase A compact and benchtop model, the Nordson March plasma system AP-300 has a volume capacity of 33.1 liters, supported by up to seven (7) adjustable shelves in

LEL Tech

Industry News: reaction (92)

ZESTRON to Showcase Cleaning Technologies and Analytical Tools at APEX 2013

Industry News | 2013-02-06 11:41:44.0

ZESTRON, is pleased to showcase MPC® and FAST®, ZESTRON’s core cleaning technologies, at the 2013 IPC APEX EXPO

ZESTRON Americas

ZESTRON Product Demonstrations at “Assembly Cleaning, Testing and Coating” Workshop at ACI Technologies

Industry News | 2013-03-27 17:05:47.0

ZESTRON, is pleased to announce that product demonstrations, facility tour, and machine demonstrations will be provided in addition to the scheduled presentations during the Assembly Cleaning, Testing and Coating Workshop at ACI Technologies.

ZESTRON Americas

Technical Library: reaction (15)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Cleanliness/Corrosion Mitigation

Technical Library | 2019-09-27 09:14:41.0

One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode.

ACI Technologies, Inc.

Videos: reaction (2)

Indium's NanoBond® Process

Indium's NanoBond® Process


How the NanoBond® Process works

Indium Corporation

Immersion gold VS Plating gold


There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious tr


Training Courses: reaction (1)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Events Calendar: reaction (3)

Void Formation in Solder Joints - Causes & Cures

Events Calendar | Mon May 16 14:30:00 EDT 2016 - Mon May 16 16:00:00 EDT 2016 | , United Kingdom

Void Formation in Solder Joints - Causes & Cures

Void Formation in Solder Joints – Causes & Cures

Events Calendar | Mon May 18 14:30:00 EDT 2015 - Mon May 18 02:30:00 EDT 2015 | Chelmsford, Essex, United Kingdom

Void Formation in Solder Joints – Causes & Cures

Career Center - Resumes: reaction (2)

B.s (Chemical Engineering) with 2 years experience in pcb industry

Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry

Sales Management International

Career Center | RACINE, Wisconsin USA | Sales/Marketing

Business Development Leader • Experienced business leader in-depth knowledge in techincal industries, candid communicator. • Expertise in building and expanding client base, increasing name recognition and market share using a wide array of tools,

Express Newsletter: reaction (6)

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant

Partner Websites: reaction (645)

Genamin T01/5000


. Genamin T 01/5000 contains terminal primary amine groups which can undergo all typical amine reactions. Benefits   The amine groups of polyether amines react faster and form more stable reaction products than the hydroxyl groups of the corresponding polyglycols

reaction searches for Companies, Equipment, Machines, Suppliers & Information

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