Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider
Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.
Industry Directory | Repair / Rework / Soldering / Service Provider
BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center
Inspect objects dynamically in 360 degrees with patented Hirox design Superior BGA inspection capable of up to 200x magnification. Low maintenance costs achieved with use of spring loaded lens tip to protect samples. Highly configurable and flexibl
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
Electronics Forum | Thu Apr 08 16:25:38 EDT 1999 | greg c
I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling thank you
Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr
I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo
Used SMT Equipment | Pick and Place/Feeders
Nice Juki factory built (not converted) 575 with some feeders included. The 575 differs from the more common 570 model because of the fact that it has laser centering AND top and bottom vision. The benefit is that the machine does a proper job of rea
Used SMT Equipment | Repair/Rework
♣ IN-Like New Condition, Only Used Twice ♣ ◘ Split-Vision Optics with 1.3 Million Pixel HD Video Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.
Industry News | 2019-01-22 12:36:28.0
Europlacer Americas announces that it will exhibit two SMT assembly lines in Booth #2511 at the upcoming 2019 IPC APEX Expo. The high-speed line will feature the company’s award-winning, ultra-flexible atom3 placement machine downstream from the advanced EP710 AVi Screen Printer. The mid-range, very-large-board manufacturing solution consists of the company’s flagship iineo+ Multi-Functional Placement System with advanced LED binning in line with its EP1220 Long Board Screen Printer.
Industry News | 2009-03-19 14:56:45.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will highlight the HIROX series of digital microscopes in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Nordson ASYMTEK | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=2
. Electronics - Semiconductor Nordson SONOSCAN Hidden Trouble in a BGA Package Nordson SONOSCAN Application Notes Nordson SONOSCAN MULTIPLE VOIDS Nordson SONOSCAN Flip Chip Underfill Multiple Voids
| https://store.aciusa.org/IPC-DRM-18J-Component-Identification-Training-and-Reference-Guide-P136.aspx
more than 50 common through-hole and surface mount components used in electronics assembly today. The new Revision H contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups
