Industry Directory | Consultant / Equipment Dealer / Broker / Manufacturer's Rep / Service Provider / Training Provider
Products, Services, Training, and Consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.
Industry Directory | Repair / Rework / Soldering / Service Provider
BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Solder Materials
Easily Reball BGA components for as little as a penny each. No solder paste required. Re-Ball components using our water wash tacky flux. No more expensive and hard to order solder pre-forms. Call (888) 406-2830
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Thu Jul 08 12:47:02 EDT 1999 | Mark
Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated! There is a large article in the current issue of Circuits Assembly magazine that says properly re-balled BGA's are perfectly fine. Also there is a re-bal
Used SMT Equipment | Repair/Rework
♣ IN-Like New Condition, Only Used Twice ♣ ◘ Split-Vision Optics with 1.3 Million Pixel HD Video Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.
Industry News | 2019-01-22 12:36:28.0
Europlacer Americas announces that it will exhibit two SMT assembly lines in Booth #2511 at the upcoming 2019 IPC APEX Expo. The high-speed line will feature the company’s award-winning, ultra-flexible atom3 placement machine downstream from the advanced EP710 AVi Screen Printer. The mid-range, very-large-board manufacturing solution consists of the company’s flagship iineo+ Multi-Functional Placement System with advanced LED binning in line with its EP1220 Long Board Screen Printer.
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Parts & Supplies | SMT Equipment
ADJUSTABLE REBALLING KIT ADJUSTABLE REBALLING KIT Welcome to visit website www.chinaszsmt.com or mail to sales@chinaszsmt.com.
Parts & Supplies | SMT Equipment
ADJUSTABLE REBALLING KIT ADJUSTABLE REBALLING KIT Welcome to visit website www.chinaszsmt.com or mail to sales@chinaszsmt.com.
Technical Library | 2008-02-20 21:42:52.0
Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Easy to use. Just press the button. This infrared table top reflow oven comes with pre-programmed reflow profiles. Excellent for reballing BGA’s and small circuit board projects. A must have for your BGA Rework and Reballing area. Call (888) 40
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
