Technical Library: reballing and problem (Page 1 of 2)

Effect of BGA Reballing and its Influence on Ball Shear Strength

Technical Library | 2013-07-11 15:22:40.0

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).

MARTIN (a Finetech company)

Performance Measurement: Connecting Strategy, Operations and Actions

Technical Library | 2001-05-23 16:29:52.0

Management consultant R. Michael Donovan outlines the problems and opportunities of performance measurement as an "enabling force" for improving overall business performance...

R. Michael Donovan & Co., Inc.

Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence

Technical Library | 2013-05-30 17:33:26.0

This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions

Fischer Technology, Inc.

Hand Soldering, Electrical Overstress, and Electrostatic Discharge

Technical Library | 1999-05-09 13:07:16.0

This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems.


The Conditions and Solutions of Lead-free Hand Soldering

Technical Library | 2013-01-05 22:21:01.0

More and more countries legislate to forbib lead usage in solder material. However, the lead-free solder wire has higher melting point and soldering temperature, increase soldering iron temperature may damage the PCB or components. How to solve this problem?

Leisto Industrial Co., Limited

List of Problems and Solutions for Centrifugal Air Compressor

Technical Library | 2021-12-22 01:35:51.0

As a speed type air compressor, centrifugal compressor can generate air flow moving in radial direction. Centrifugal air compressors are used by a large number of companies today because of their high-pressure tightness. Therefore, common faults in the operation have become one of the most concerned issues for users. This article will discuss causes of centrifugal compressor failures and give corresponding maintenance measures. At the end, OKmarts has listed the problems and solutions in detail for your quick reference.

OKmarts Industrial Parts Mall

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems

Technical Library | 2012-04-05 22:53:10.0

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob

Georgia Institute of Technology

SMT chip capacitor resistor storage and processing method

Technical Library | 2022-04-27 01:34:43.0

SMD capacitors and resistors have small sizes and many models. Some manufacturers buy a lot of products and do not use them up in time. The problem of storage is always a headache. So how should chip capacitors and resistors be stored? There are also precautions when using chip capacitors. Please see the following information and hope it will help you.

Leaderway Industrial Co.,Ltd

Notices in the use of temperature and humidity Test Chamber

Technical Library | 2019-05-06 23:04:05.0

The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.

Symor Instrument Equipment Co.,Ltd

Solder Phase Coarsening, Fundamentals, Preparation, Measurement and Prediction

Technical Library | 2009-05-07 23:23:00.0

Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed.

DfR Solutions

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