Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti
New Equipment | Assembly Services
www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner SMT Offline X-ray X-7200 Introduce: I.C.T X-7200 inspection machine has a wide range of applications. It is commonly used in the internal structure testing of electronic component
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
Electronics Forum | Sun Oct 21 22:17:19 EDT 2012 | eadthem
We have had this issue on several parts in the past, typically we use a grid of squares of solder paste on large flow areas, This helps reduce but not eliminate all voiding. I would be very interested in hearing what you come up with. O and what is
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
| http://etasmt.com/cc?ID=te_news_bulletin,23577&url=_print
. The paper discusses thesignificant results that have been achieved in reducing voids to < 1%. Another key area to be discussed is the maximizing of the unit per hour (UPH
