Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Mon Dec 17 13:58:54 EST 2007 | ck_the_flip
I made my own wave measuring device using KIC2000 system. KIC2000 has automatic wave detection, so now I have a profiler for both reflow ovens and wave solder. The delmat carrier only cost $500. A guy, Samir, from this forum gave me the idea, actu
Electronics Forum | Fri Feb 21 04:52:59 EST 2003 | Neil
Is anyone producing products using intrusive reflow soldering????
Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101
Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo
Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Fri Feb 21 08:41:06 EST 2003 | davef
Yes. Reflow soldering PTH components goes under different names. * SMTnet's friend Bob Willis popularized the "intrusive reflow soldering" term. * Jim Blankenhorn, another of our friends, and others popularized "pin and paste". * Still others use
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Fri Jan 22 08:25:18 EST 2010 | davef
This socket supplier never expected you to do what you're doing to his/her part. Some materials bear-up under the thermal strain of reflow solder than others. Try different socket materials.
