http://www.flason-smt.com/product/Hitachi-TCM-X300-Pick-and-Place-Machine.html Hitachi TCM-X300 Pick and Place Machine Hitachi TCM-X300 Pick and Place Machine Head: 12 Heads PCB:560 mm * 460 mm Equipment weight: 4800KG Product description: Hi
Hitachi TCM-X300 Pick and Place Machine Hitachi TCM-X300 Pick and Place Machine Head: 12 Heads PCB:560 mm * 460 mm Equipment weight: 4800KG Product description: Hitachi TCM-X300 Pick and Place Machine -Good Price! Good Quality! Good Service!
Electronics Forum | Mon Jun 20 10:44:29 EDT 2005 | ??
I am sure you can reflow lead free in any oven but i thought i read that lead free requires a cooling stage to get the solder joints reflowed "correctly".
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
SMTnet Express, February 11, 2016, Subscribers: 24,106, Members: Companies: 14,981, Users: 39,912 Effective Methods to Get Volatile Compounds Out of Reflow Process Gerjan Diepstraten; Vitronics Soltec Although reflow ovens may not have been
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
| https://www.wesource.com/test-and-measurement-equipment/gossen-m504g-mavo-monitor-usb-id-60089/
and Accessories Miscellaneous Ovens PC Board Cleaners Reflow Ovens Rework Systems and Accessories Screen Printers Selective Soldering Machines Solder Paste and PCB Inspection Machines Spare Parts
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4,000 GPD Global® CF-8 Precision Axial Lead Former 12/08/94 Specifications2-8 Figure 8 Component Elements Lead Pitch = .2", .4" (5mm, 10mm) 2.2.4 Processing Ranges Figure 8 and Figure 9 below illustrate various component elements. The CF-8 is capable of
