Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Siemens Blister Unit DLM2 DLM3 00367793 Siemens Blister Unit DLM2 DLM3 00367793 SMT Spare Parts Siemens Spare Parts Delivery time: 1-3 days Product description: Siemens Blister Unit DLM2 DLM3 00367793 INQUIRY Siemens Blister Unit DLM2
New Equipment | Board Handling - Storage
Eureka TUS-501 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-501 Model: TUS-501 Fast Super Dryer Capacity: 372 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing doo
Electronics Forum | Mon Apr 14 14:11:30 EDT 2008 | cyber_wolf
I dont know if this is related, but there appears to be a blister/measle in the upper right corner of the Q19 large pad. (upper right of Q19 as you are facing the photo) If your profile and paste is good, my bet would be that there is something wron
Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp
I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
