The OmniMax reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. IsoThermal™ Chamber Technology The OmniMax reflow soldering system is designed to deliver maximum thermal per
The OmniES™ is proven to exceed lead-free profile requirements and delivers efficient high performance thermal processing. IsoThermal™ Chamber Technology The OmniES offers a combination of innovation and industry-proven technologies in
Electronics Forum | Mon Mar 26 08:52:19 EDT 2007 | realchunks
Hi J, Yes, we do too. Funny thing is I was just looking at this last Friday. We call it sharing the bottom of the barrel. Typically it's just Process Engineers stuck down here, but from time to time, Maintenance gets stuck down here too. When in
Electronics Forum | Tue May 16 07:44:42 EDT 2006 | Chunks
Hi smtspecialist (man I gotta get me a name soon), NO! Your oven cannot contaminate your process. Unless you have flux residues dripping on your board, there is nothing to worry about. Now having your operators switch from leaded to lead-free smo
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Industry News | 2012-02-15 20:26:28.0
Kyzen had introduced a new and improved product for cleaning pallets and maintenance applications.
Industry News | 2010-02-22 11:53:39.0
Rehm Thermal Systems has moved into a new Applications Center which will serve their North America marketplace. Located in the Atlanta suburb of Roswell, the new facility is designed to provide Rehm customers everything needed to characterize their convection and condensation reflow processes.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Career Center | Thanjavur, India | Production,Quality Control,Technical Support
work in one year and above Quality engineer in sanmina,current work in SMT Technical engineer in coimbatore
SMTnet Express, February 11, 2016, Subscribers: 24,106, Members: Companies: 14,981, Users: 39,912 Effective Methods to Get Volatile Compounds Out of Reflow Process Gerjan Diepstraten; Vitronics Soltec Although reflow ovens may not have been
Flux Collection and Self-Clean Technique in Reflow Applications Flux Collection and Self-Clean Technique in Reflow Applications The flux management system for a reflow oven is highly critical to the quality, cost, and yield of a reflow process
