Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider
Assembly process optimization and training .
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Electronics Forum | Tue Sep 26 18:29:15 EDT 2006 | stepheniii
Profile, profile, and profile. If you can sacrifice a board, the best is to drill a small hole into the a ball from the other side of the board and insert a thermocouple there. I'm 99.99% certain you won't be able to sacrifice a board. (who can the
Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ
could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Used SMT Equipment | Soldering - Reflow
Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed. PC& Siemens PLC controlling unit with
Industry News | 2014-04-22 14:31:18.0
MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Delavan, Wisconsin USA | Production
*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Career Center | Mariveles, Philippines | Engineering,Production,Quality Control
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, December 12, 2013, Subscribers: 26406, Members: Companies: 13519, Users: 35511 Using Physics of Failure to Predict System Level Reliability for Avionic Electronics by Greg Caswell; DfR Solutions Today's analyses of electronics
SMTnet Express, October 24, 2019, Subscribers: 32,268, Companies: 10,908, Users: 25,250 Investigation of PCB Failure after SMT Manufacturing Process Credits: ACI Technologies, Inc. An ACI Technologies customer inquired regarding PCB failures
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Heller Industries Inc. | https://hellerindustries.com/searchqueries/
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