Industry News: reflow profile for glue curing (Page 1 of 6)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Industry News | 2024-03-27 09:07:10.0

The world of PCB assembly is constantly evolving, and Red Glue SMT Solutions offer a revolutionary approach for double-sided printed circuit board assemblies (PCBAs). This innovative technique overcomes limitations of traditional solder paste and reflow ovens, paving the way for increased efficiency and cost savings.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

KIC and SMT Thermal Discoveries partner to offer automated, inline reflow inspection for vacuum reflow

Industry News | 2020-07-04 04:40:23.0

KIC, innovators of the industry's number one reflow process inspection system, and SMT Thermal Discoveries, a leading manufacturer of state-of-the-art reflow and vacuum technology, have partnered to integrate KIC's market-leading technology into SMT's multiple award-winning vacuum reflow oven (as well as their standard reflow solutions).

KIC Thermal

KIC releases new smart technology for real-time insight into reflow and wave solder processes

Industry News | 2017-10-12 15:05:21.0

KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all relevant data.

KIC Thermal

KIC to showcase new integrated fixture and profiler designed for tracking reflow oven stability at NEPCON Asia

Industry News | 2019-08-08 08:16:10.0

KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0

KIC Thermal

Datapaq4 Thermal Profiling for $2985.

Industry News | 2003-03-31 11:13:17.0

Finally affordable thermal profiling for CEMs and OEMs

Datapaq, Inc.

KIC: #1 solution for turning heat into data at Productronica

Industry News | 2019-10-16 14:39:56.0

KIC announced that it will exhibit in Hall A4, Booth 506 at Productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The KIC Europe team will discuss Industry 4.0 automation, traceability, NPI setup, machine verification, and more, all for your thermal processes; reflow, wave solder and cure. RPI i4.0. is a simple solution and a great way to start your Industry 4.0 journey, changing heat to data on your reflow oven.

KIC Thermal

KIC Receives Global Technology Award for Its SPS Smart Profiler

Industry News | 2017-11-15 17:25:25.0

KIC announces that it was awarded a 2017 Global Technology Award in the category of Assembly Tools for its SPS Smart Profiler. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. The SPS utilizes smart factory technologies to acquire and analyze thermal process for new insight and actionable data leading to increased production line utilization, reduced rework and electricity use.

KIC Thermal

KIC Appoints Distributor for Brazil

Industry News | 2010-04-10 23:57:35.0

San Diego - KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Focus Da Amazonia is its new distributor for all of Brazil.

KIC Thermal

Essemtec Premiers New Pick-and-Place System for 3D-MID

Industry News | 2008-11-18 17:22:43.0

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.

ESSEMTEC AG

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