Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Wed Feb 07 16:14:54 EST 2001 | Antonio
I've recently read a posting here which said that the person was trying to reduce solder balls. One of the things the person had done was to adjust the reflow profile so as to be hotter and longer in the reflow state. Am I wrong here? I thought th
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Used SMT Equipment | Soldering - Reflow
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformi
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Rancho Cucamonga, California USA | Production
The successful candidate will have at least one year experience and knowledge in Pick and Place programming for machines such as Fuji, Samsung, Panasonic, or Tyco; stencil printing and solder past knowledge; wave solder and wave solder washing proce
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
| http://etasmt.com/cc?ID=te_news_industry,24565&url=_print
>> SMT Technical How to optimize the reflow profile? According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below
| https://www.wesource.com/company-profile
Cleaners Pumps and Motors Reflow Ovens Rework Systems and Accessories Screen Printers Selective Soldering Machines Solder Paste and PCB Inspection Machines Spare Parts DEK Juki MyData Philips/Assembleon
