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Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
http://www.flason-smt.com/product/SMT-AOI-Machine.html SMT AOI Machine ZW 800 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:980*1080*1410 mm Weight: 600kg Product description: SMT AOI Machine ZW 800 INQUIRY
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ
So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2014-02-03 14:13:04.0
FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes.
Technical Library | 2023-09-16 06:27:24.0
Vacuum reflow ovens are the best way to solder SMD components. They create a controlled environment that prevents oxidation and improves solder joint quality.
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
ORPRO Vision AOI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion S36 Plus and Vantage S22 Plus AOI systems. For additional information, please contact ORPRO Vision at sales.us@orprovision.co
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SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
Heller Industries Inc. | https://hellerindustries.com/tombstoning/
the component Reflow-related causes of Tombstoning in PCB Soldering: Improper pad design may be aggravated by use of nitrogen. The nitrogen increases surface tension of the metals to the extent that a previously marginal problem becomes distinct
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
How to Prevent a Solder Ball Defect | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
