Technical Library: removing oxidation (Page 1 of 1)

Identifying Flux Residues

Technical Library | 2019-05-23 10:42:00.0

Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.

ACI Technologies, Inc.

Reduced Oxide Soldering Activation (ROSA)

Technical Library | 2007-07-19 15:15:11.0

ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries.

Electronics Manufacturing Productivity Facility (EMPF)

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