Saul Research provides research-based design facilities for analog and RF chip design. We can supply small quantities of custom designed ASICs. Design work is approved to ISO9001 standard.
Industry Directory | Manufacturer
Passive RF and Microwave Components
New Equipment | Assembly Services
Specification Model Item High -Speed Compact Modular Mounter RX-7R (P16SxP16S head) (P16Sxp8 head) (P8xP8 head) Board size Single lane conveyer
New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Used SMT Equipment | Chipshooters / Chip Mounters
RS-1XL Features ▶Class leading speed, up to 42,000 cph. ▶0201* ~ 74mm×74mm / 50mm×150mm. ▶Wide component range. ▶Optimum line balance and highest throughput. ▶Newly developed "Takumi Head" with changing recognition sensor height. ▶JUKI's laser center
Used SMT Equipment | Chipshooters / Chip Mounters
RS-1XL Features ▶Class leading speed, up to 42,000 cph. ▶0201* ~ 74mm×74mm / 50mm×150mm. ▶Wide component range. ▶Optimum line balance and highest throughput. ▶Newly developed "Takumi Head" with changing recognition sensor height. ▶JUKI's laser center
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Parts & Supplies | Chipshooters / Chip Mounters
JUKI RS1 RF44MM SMT FEEDER More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Chipshooters / Chip Mounters
supplying JUKI RF SMT Electric Feeder RF08AS RF12AS RF16AS RF24AS JUKI RF SMT Electric Feeder RF08AS RF12AS RF16AS RF24AS RF32AS RF44AS JUKI Electric Feeder RF Series RF08AS RF12AS RF16AS RF24AS RF32AS RF44AS The new RF Series feeders are smalle
Technical Library | 2008-02-26 15:02:19.0
More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
JUKI RS-1XL SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and lace machine, SMT pick and place machine, JUK
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Melbourne, Florida USA | Engineering,Research and Development
Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F
| https://www.wesource.com/miscellaneous/chroma-led-wafer/chip-prober-model-5815-id-001875-4/23/
Chroma LED Wafer/Chip Prober Model 5815 ID_001875 (4/23): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_semiconductor_toray.html
Toray Toray High Speed Flip Chip Assembly Line Used for Smartcard and RF Tag Manufacturing Model CF 1000R 3" core mechanical shaft 6" core adapters for the 3 " shaft ILT-1000 inline tester Never used in
