Industry Directory: rf shield (11)

Westaim Ambeon

Industry Directory |

supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.

P&P Technology Ltd

P&P Technology Ltd

Industry Directory | OEM

Specialist manufacturers of EMI /RF screening and shielding products

New SMT Equipment: rf shield (1124)

5G communication board PCB design case

New Equipment | Prototyping

[Single board type] 5G RF communication board (VPX architecture) [Pin number] 10731 [layers] 16 layers [Maximum rate] 10Gb/s [Difficulties]: 1, There are 8 RF channels, the RF line rate is 2.5G, and the requirement of the signal integrity is hig

ShenZhen J-wide Electronics Equipment Co.,Ltd

BLS rf shield solder

BLS rf shield solder

New Equipment | Fabrication Services

BLS rf shield solder Good solderability  In house tooling room  ISO 9001 CE ROHS 

Jingyi Precision Technology Co.,ltd

Electronics Forum: rf shield (36)

RF shield clips

Electronics Forum | Thu May 01 11:56:04 EDT 2008 | realchunks

It sounds like this part is floating on your solder joint during reflow. You may need to redesign your pad geometry. In general with this type of clip - smaller pads are better. If you cannotcahnge pad size, try changing the openings on your stenc

RF shield clips

Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf

We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons

Used SMT Equipment: rf shield (27)

Ramsey Ramsey STE5000

Ramsey Ramsey STE5000

Used SMT Equipment | In-Circuit Testers

Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure represents a breakthrough

Test Equipment Connection

Ramsey STE5000

Ramsey STE5000

Used SMT Equipment | In-Circuit Testers

Ramsey STE5000 Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure repres

Test Equipment Connection

Industry News: rf shield (31)

Nordson ASYMTEK Teams with Parker Chomerics for High-volume, Precision Conductive Coating Spray Application

Industry News | 2016-07-10 13:54:05.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.

Nordson ASYMTEK

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Parts & Supplies: rf shield (10)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Juki  VQZ212-5G-M5-F

Juki VQZ212-5G-M5-F

Parts & Supplies | Pick and Place/Feeders

Supply & repair juki ejector at a lower price: JUKI 750(760) EJECTOR E79117250A0 VP*0749 JUKI 750(760) EJECTOR (E3066700000,PISCO VBH07-46) JUKI 750(760) 4-WAY ELECTROMAGNETIC VALVE  PV140507000 VQD1121W-5MO-C4-X8B JUKI 750(760) ELECTROMAGNETIC V

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: rf shield (36)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: rf shield (7)

Solder Paste capabilities with the SV-100 Slider Valve

Solder Paste capabilities with the SV-100 Slider Valve

Videos

Dispensing dots, lines and into recessed cavities. Video was shot with a lipstick camera mounted to the dispense head. http://www.nordsonasymtek.com

Nordson ASYMTEK

SMT rf shielding cover

SMT rf shielding cover

Videos

Ningbo Hexin customized with metal shielding cover for pcb board with reel and tape packing

Ningbo Hexin Electronics Co.,Ltd.

Events Calendar: rf shield (1)

2017 RaMP Workshop and Tabletop Exhibition

Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France

2017 RaMP Workshop and Tabletop Exhibition

International Microelectronics Assembly and Packaging Society (IMAPS)

Career Center - Resumes: rf shield (2)

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0

Engineering

Engineer

Career Center | Kathmandu, Nepal | Engineering

I have been working from last 4 years in different field and  post. Where i can gather different experiences and enhanced my knowledge of real field. I am really storng canididates for the technical post. Hon of bachelor in electronics and communicat

Express Newsletter: rf shield (143)

SMTnet Express - February 27, 2020

SMTnet Express, February 27, 2020, Subscribers: 34,359, Companies: 10,970, Users: 25,651 Dispensing EMI Shielding Materials: An Alternative to Sputtering Credits: Nordson ASYMTEK Shielding electronic systems against electromagnetic interference

Partner Websites: rf shield (46)

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

| http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

resolution, 16-bit 1 available USB port for data download 1 available USB port for software key     Included KIC 'X 5 ' Kit Contents Slim-design thermal profile Thermal shield Software CD with Navigator Power and SPC software Software protection dongle USB cable (A male/mini-B) RF transmitter (on RF models) AAA batteries (6


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