[Single board type] 5G RF communication board (VPX architecture) [Pin number] 10731 [layers] 16 layers [Maximum rate] 10Gb/s [Difficulties]: 1, There are 8 RF channels, the RF line rate is 2.5G, and the requirement of the signal integrity is hig
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Electronics Forum | Mon Oct 24 11:39:54 EDT 2016 | jrrt_williams
We are currently running FUJI XPF lines and receive all of our RF shields in T/R format. The large shields we use come on a reel of 500, the small shields come on a reel of 800. both much more efficient than using trays.
Electronics Forum | Wed Nov 09 09:08:40 EST 2016 | sumote
We are currently running FUJI XPF lines and > receive all of our RF shields in T/R format. > The large shields we use come on a reel of 500, > the small shields come on a reel of 800. both > much more efficient than using trays. I agree. Get
Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure represents a breakthrough
Ramsey STE5000 Ramsey STE5000 Wireless device testing Perfect for 802.11a, b, g Bluetooth, RFID, 3G testing Wide variety of I/O options Super isolation up to 18GHz Stock models to fit your custom applications The STE5000 enclosure repres
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
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Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
Career Center | Kathmandu, Nepal | Engineering
I have been working from last 4 years in different field and post. Where i can gather different experiences and enhanced my knowledge of real field. I am really storng canididates for the technical post. Hon of bachelor in electronics and communicat
SMTnet Express, February 27, 2020, Subscribers: 34,359, Companies: 10,970, Users: 25,651 Dispensing EMI Shielding Materials: An Alternative to Sputtering Credits: Nordson ASYMTEK Shielding electronic systems against electromagnetic interference
. EM Series systems are designed to be ultra Rigid and durable with FEM Simulations performed during the design phase. The unique Pattern Matching algorithm enables programming of odd-shaped components such as RF Shields etc
. This key advantage of inspecting hidden solder joints makes AXI the logical choice for inspection of complicated boards, especially ones with BGAs, CGAs, CSPs or components that are under RF shields