The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW! All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a
Electronics Forum | Sun Mar 20 15:05:28 EDT 2011 | floydf
We are preparing to run a 2-sided board with BGAs on one side and passives on the other side. We have two schools of thought on which side we should run first. One school says run the passive side first, then run the BGA side and the surface tensio
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
Industry News | 2019-01-22 16:00:09.0
At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.
Parts & Supplies | Assembly Accessories
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Parts & Supplies | Pick and Place/Feeders
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Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
The biggest, baddest, most affordable Nitrogen Capable BGA Rework Station demonstrated by Dennis O'Donnell the BGA Expert! Safe, precision rework for SMD, BGA, and LED chips on boards as large as 36" or more!. The versatile E6250U rework station co
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
primary system sample movement and is adjusted for the depth of the BGA in the sample (e.g. is it on side one or side two). In this regard, a suitable magnification must be selected for the imaging such that each BGA ball occupies a reasonable number of
GPD Global | https://www.gpd-global.com/pdf/doc/Side-Mount-Loader-Unloader-Guide-24000600.pdf
© 11/13/17 Side-Mount Loader & Unloader User Guide ii Table of Contents Introduction ..................................................................................1 Installation
