Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
Syntek Inc. is an ISO certified and UL approved offshore bare board supplier. Syntek can provide prototype quantities up to high volume production.
Industry Directory | Manufacturer
PCB Assembly in Indonesia with ISO Certificate Are you looking for SMT and PCB Assembly ? We provide SMT and PCB Assembly service in Indonesia. Located at bonded zone West Java Indonesia. Suitable for export oriented market.
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
Design Assistance Printed Circuit Board Assembly Prototyping & New Product Introduction (NPI) High-mix/low-volume Medium-mix/medium-volume Electro-Mechanical Assembly Cable assembly Sub-assembly – i.e. Chassis assembly and wiring Full system assembly
Electronics Forum | Mon Aug 11 11:00:40 EDT 2008 | eyalg
RoHS BGA. No lead in it. > RoHS BGA. No lead in it. ok. this is not the case .It was sn/pb type...
Electronics Forum | Mon Aug 11 10:55:43 EDT 2008 | realchunks
RoHS BGA. No lead in it.
Used SMT Equipment | Conveyors
PCBA manufacturer. Our company is engaged in Reliable OEM / ODM PCBA assembly services for electronic applications. Main Products and services: PCBA (Printed Circuit Board Assembly) 1. The high standard workshops for SMT, Dipper, and Assembling en
Industry News | 2011-08-08 16:18:31.0
The SMTA announced that the Contract Manufacturing Symposium will be held on October 18, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The symposium, aimed at OEMs, and EMS program managers and executives, looks at risk mitigation strategies from Asia to Eastern Europe, and selected SMT processing solutions that could benefit those companies grappling with RoHS and other environmental or leading-edge (high BGA pin count) technical issues.
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2014-01-23 16:49:55.0
As reliability requirements increase, especially for defense and aerospace applications, the need to characterize components used in electronic assembly also increases. OEM and EMS companies look to perform characterizations as early as possible in the process to be able to limit quality related issues and improve both assembly yields and ultimate device reliability. In terms of BGA devices, higher stress conditions, RoHS compatible materials and increased package densities tend to cause premature failures in intermetallic layers. Therefore it is necessary to have a quantitative and qualitative test methodology to address these interfaces.
OurPCB Tech Limited(www.ourpcbte.com) was founded in 2005, We have provided a professional Printed circuit board & PCB Assembly services for more than 2,500 customers around the globel.
TI New and Original LM3480IM3X-5.0/NOPB in Stock IC SOT23 , 21+ package LM3480IM3X-5.0/NOPB 100mA, 30V Low Dropout RegulatorToday's Hot Deals： TDA8922CTH/N1 HSOP24 NXP 20+ SAK-TC1796-256F150E BE BGA INFINEON20+ KSZ8863FLL LQFP48 MICROCHIP
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Career Center | , Minnesota | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
New BGA Solder Mask Repair Technique Using Laser Cut Stencils If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ New BGA Solder Mask Repair Technique Using Laser Cut Stencils Best, Inc
SMTnet Express, December 19, 2013, Subscribers: 26421, Members: Companies: 13524, Users: 35538 Mixed Metals Impact on Reliability by Rick Gunn; Nextek With the adoption of RoHS and implementation of Lead Free solders a major concern is how
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pl-PL/divisions/efd/resource-center/solder-selection-guide
bezołowiowego stopu lutowniczego. Czasami jest to spowodowane koniecznością przestrzegania dyrektywy RoHS (w sprawie ograniczenia stosowania
