Industry Directory | Manufacturer
Additive modifies bare PCBs by adding solid copper traces, SMT Pads and deletes even under BGAs. RoHS / non-RoHS bare boards when engineering changes are needed and re-design is not done. Improve quality, thru-put and reliabilty while lowering cost.
Industry Directory | Manufacturer
Elscott specializes in low to medium volume PCB assembly. We manufacture to military specifications and can be RoHS compliant. We have 0201 chip capabilities and do quick turn prototyping.
New Equipment | Assembly Services
Printed Circuit Board Assembly (1206 to micro BGAs) (Rohs - non Rohs) [All paste types ( water soluble, no clean etc)]
New Equipment | Assembly Services
Multiiple assembly lines and highly trained staff support IPC level 1, 2, and 3 assembly of both surface mount and through-hole technology products. PCB assembly we offer: Surface mount, including BGAs and micro-BGAs Through-hole Mixed
Electronics Forum | Thu May 29 17:18:51 EDT 2014 | island2013
whats the type of paset and the type of profile you're running. Doesn't look like enough heat to me on the first set of pics I see. Are you running ROHS BGAs on a lead profile?
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Industry News | 2012-07-24 08:11:29.0
Kyzen announces that Dr. Mike Bixenman will present at the upcoming technology symposium hosted by BEST, Inc. entitled, “Sharpening Your Tools-Area Array Technology,”
Technical Library | 2016-11-17 14:58:02.0
Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component.
OurPCB Tech Limited(www.ourpcbte.com) was founded in 2005, We have provided a professional Printed circuit board & PCB Assembly services for more than 2,500 customers around the globel.
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
| http://www.szhonreal.com/uploadfile/Download/202305231109343783.pdf
. ●The machine complies with the “JUKI Group Green Procurement Guidelines” on the use of hazardous substances, which is stricter than other restrictions, such as those of the RoHS Directive
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: Whisker Inspection Results André M. Delhaise, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri Abstract 32-2 Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage Pradeep Lall, Kartik
