Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii
Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli
Electronics Forum | Tue Feb 06 06:41:53 EST 2007 | pavel_murtishev
Good afternoon, You have to use lead paste since none-RoHS components won�t withstand elevated temperatures. Solder paste manufacturers offer a lot of transitional pastes designed specially for mixed process. Ask your paste supplier for transitional
Electronics Forum | Tue Dec 07 14:15:18 EST 2021 | majdi4
Hello Jinesh , if you can provide us with component datasheet , stencil design vs PAD design (GBX) and the thermal profil you use.. It would help us to found out the issue and help you.
Electronics Forum | Tue Dec 21 12:11:06 EST 2021 | jseewald
You likely have raised belly pads. If possible, do a step-up on the thermal pads to compensate for the additional height of the component in this area. Some reduction/adjustment of the gullwing pads may be necessary, so be prepared for a few iterat
Electronics Forum | Mon Dec 06 14:44:41 EST 2021 | dwl
1 to 1 stencil aperture to pad should be fine on the gull leads, and yield 100% coverage with leaded solder. The thermal pad is going to be a challenge though, if you truly need 100% coverage. There will be out gassing from the flux and this will nee
Electronics Forum | Mon Dec 06 18:28:24 EST 2021 | emeto
What is your current paste coverage? You mentioned windowpane and you mentioned 5mil stencil. You did not mention if PAD design meets recommendation? If it does, go 6mil and more paste coverage to increase volume.
Electronics Forum | Tue Dec 07 07:59:36 EST 2021 | jineshjpr
Hi Evtimov, Thanks for your response - Coverage of Paste on the pad is 85 % (By considering window & outer area), Let me revert back after PAD design vs Recommendation verification.
Electronics Forum | Mon Dec 27 05:01:03 EST 2021 | jineshjpr
Hi JSeewald, You are very much right that there is difference between the solder pad with respect to IC pad. Since the Manufacturer suggests the same -- design also freezed to recommended dimensions.
Electronics Forum | Mon Dec 27 05:23:03 EST 2021 | jineshjpr
Hi Djo, very much sorry to say that no gbx file is available with me (Customer not yet supplied). Sharing you image of stencil design.
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
