New Equipment | Rework & Repair Equipment
SemiPack offers BGA Reballing Services with speed, reliability and affordability that are unrivalled in the industry. The Restriction of Hazardous Substances (RoHS) directive restricts the use of lead in nearly all electronic components used today.
New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
Electronics Forum | Fri Oct 12 13:41:17 EDT 2007 | patrickbruneel
I found the right RoHS equation: SnPb - Pb + Cu +Ag = Au Have a great weekend lol
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2010-01-22 21:37:52.0
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.
Technical Library | 2012-08-30 21:24:29.0
This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications.
Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Cleaning Ning-Cheng Lee, Ph.D. Abstract 23-1 Reliability Study and AF Modeling for SnAgCu Solder Joints and SnPb Solder Joints in QFN Packages Dong Hyun Kim, Mudasir Ahmad, Sue Teng Abstract 23-1 Second Generation Pb-Free Alloys Randy Schueller, Ph.D
