Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2003-06-25 12:28:40.0
The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.
Industry News | 2011-10-03 15:37:21.0
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2020-10-03 08:26:05.0
Technically speaking, IPC APEX EXPO 2021 is the place to be. The place to learn. The place to collaborate. The place to explore. IPC APEX EXPO 2021 is the place to be in March, not in January. Why?
Industry News | 2020-10-10 04:56:46.0
Technically speaking, IPC APEX EXPO 2021 is the place to be. The place to learn. The place to collaborate. The place to explore. IPC APEX EXPO 2021 is the place to be in March, not in January. Why?
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2015-06-01 12:27:38.0
Engineered Materials Systems announces the introduction of its new EMS 618-15 Adhesive. The room temperature cure two-part conductive adhesive has been designed for circuit assembly applications.
Industry News | 2017-06-06 10:38:43.0
YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
