Industry News | 2017-05-30 20:05:30.0
3D inspection technology leader Koh Young Technology marked 15 years of continuous success in providing Total 3D inspection solutions to SMT/PCB assembly and other manufacturing industries. Koh Young celebrated its 15th Foundation Day on May 1, 2017. Established in 2002, Koh Young has led the industry in providing the world’s most advanced 3D measurement quality assurance solutions, including its market-leading Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems.
Industry News | 2012-08-01 16:59:34.0
How can you prepare new product introductions more effectively, create error-free placement programs and make sure that even the first batch of a product is produced with maximum quality?
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
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