Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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Helping businesses find each other.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Mon Aug 05 17:24:16 EDT 2013 | jorge_quijano
Hola Valeriy Not sure how the S15 works, but on the S20s & F4s there is a file on the C:WindowsSystem32driversetchosts that contains the Machine controller IP address & the Line Controller IP address, hope it helps. Saludos
Electronics Forum | Mon Oct 11 11:51:10 EDT 2004 | fastek
It was real fun in the 70's and 80's. It stopped being fun in the 90's.
Used SMT Equipment | Soldering - Reflow
Heller 1800S Reflow Oven Vintage: 1998 Serial Number: 029631C with manuals
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Viscom Model: S3088 Basic Vintage: 2016 Description: Solder Paste Inspection Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay
Industry News | 2023-04-19 17:43:01.0
As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Parts & Supplies | Pick and Place/Feeders
For those of you in need of #Mydata Agilis Feeders and/or magazines, make sure you check out this online auction ASAP. https://lnkd.in/e4ZkS5hW
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2017-07-21 03:23:47.0
1.Choose a feeder with best chip-placement ratio, install the Calibration Ruler on this feeder, then place feeder to calibration equipment’s position table.
Nano-copper sintering in formic acid vapor.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Wed Feb 20 00:00:00 EST 2019 - Wed Feb 20 00:00:00 EST 2019 | ,
Wisdom Wednesday Webinar: Highlights of IPC’s 2018 PCB Technology Trends Study
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | Geneva, GENEVA Switzerland | Sales/Marketing,Technical Support
URGENT � Entreprise de fabrication de circuits imprim�s proche fronti�re, en pleine expansion, tr�s comp�titive, gros potentiel, cherche Technico-Commercial qualifi�(e) ayant de bonnes r�f�rences aupr�s des acheteurs et grands-comptes fran�ais. R�mun
Career Center | Dehradun, uterakhand India | Research and Development
• Languages: ASSEMBLY LANGUAGES (8051,8085, 8086), FUNDAMENTALS OF C • Designing Software known: MULTISIM, Project Navigator (VHDL), Mat Lab, PCB Designing, PLC & SCADA, NI VDM- 2009 and NI Lab View- 2009. Area of Interest • Embedded System • M
Career Center | delhi, India | Engineering,Production
LOGIC DEGINE, NETWORKING, JAVA. I HAD DONE ONE PROJECT ON EMBEEDED SYSTEM .
| https://www.smtfactory.com/S-Series-Reflow-Oven-pl3089223.html
S Series Reflow Oven, S Series Reflow Oven Products, S Series Reflow Oven Manufacturers, S Series Reflow Oven Suppliers and Exporters - Shenzhen ETA Technology Co., Ltd. English Français Pусский Español Português Deutsch Italiano 日本語 한국어 Tiếng Việt
Heller Industries Inc. | https://hellerindustries.com/parts/96136m/
96136M - M5 X 10mm LG HHCS S/S Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
