Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Hitachi TCM-X300 Pick and Place Machine Head: 12 Heads PCB:560 mm * 460 mm Equipment weight: 4800KG Charge quantity: 144 Product description: Hitachi TCM-X300 Pick and Place Machine, Head: 12 Heads, PCB:560 mm * 460 mm, Equipment weight: 4800K
Electronics Forum | Tue Jan 26 10:47:39 EST 2010 | oeidave
Hi, Thank you for posting your question. Omron Electronics provides both High End AOI and 3D SPI systems. I believe that our S7oo series AOi and VP 5000 or VP 6000 3D SPI systems will meet your needs. Please feel free to contact me via email (david.
Electronics Forum | Thu Sep 08 09:41:51 EDT 2005 | PWH
If you do find your camera is bad, I think they are relatively easy to replace if you get a new one. I have done a 1.0 and 4.0 GSM camera replacements but not a PEC as of yet. If it's like the 1.0 and 2.6 and 4.0's, likely it is not tough but will
Industry News | 2013-03-12 14:06:44.0
Essemtec Brazil is substantially expanding its sales and service organization in Brazil to provide the highest level of quality in all aspects of its business.
Industry News | 2013-10-08 16:27:28.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
| https://ipcapexexpo.org/exhibitors/turnkey-booth-packages
. Labor to install and dismantle included. No substitutions. Advanced Rates on or before April 10, 2020 $4,500 Member $6,000 Non-member Rates after April 10, 2020 $5,000 Member
PCB Libraries, Inc. | http://www.pcblibraries.com/downloads/LE-Datasheet-Korean.pdf
Microsoft Word - FPX Datasheet_KOREAN v4.docx 고밀도 다이나믹 라이브러리 전혀 다른 룰의 전 PCB 라이브러리를 단번에 쉽게 재 구축! 10µm의 고밀도 기술에 의해 정확도와 유연성 제공. 전 라이브러리 업그레이드 IPC 표준 라이브러리로의 전환 4,500+개 이상의 독창적인 부품 패키지 Inch단위에서 Metric 단위로의 변경 라이브러리에 대한 일관성 적용이 용이 - 숙련도 차이 별 각자
