New SMT Equipment: sac105 galden 230 (1)

General Electric IC3600EPSU1N1E  Gas Turbine Spare Parts

General Electric IC3600EPSU1N1E Gas Turbine Spare Parts

New Equipment | Industrial Automation

Contact: Nancy Lin Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 ​​​ Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s - Dri

Amikon Automation Equipment Co., LTD

Electronics Forum: sac105 galden 230 (3)

Vapor soldering

Electronics Forum | Fri Apr 30 15:51:06 EDT 2010 | ldavis

We are using an Asscon VP800 with Galden LS230 fluid. This is a batch machine but is working well in our high mix-low volume environment.

Vapor (vapour) Phase?

Electronics Forum | Mon Jun 16 16:57:34 EDT 2008 | ldavis

We are using VP on all of our lead free assemblies. 1. We are getting great, very repeatable results. 2. The profiles were created during the implementation of the equipment and we only change 3 parameters for each assembly processed. Heater power,

Technical Library: sac105 galden 230 (5)

Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Technical Library | 2018-08-22 14:05:42.0

Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.

Institute of Electrical and Electronics Engineers (IEEE)

Accurately Capturing System-Level Failure of Solder Joints

Technical Library | 2020-02-05 18:20:06.0

Consortium Projects - Thermal Cycling Reliability Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..

DfR Solutions

Express Newsletter: sac105 galden 230 (35)

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