New SMT Equipment: sac105 profile (1)

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

Electronics Forum: sac105 profile (3)

Mixed SAC105 and SAC305

Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider

Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.

Mixed SAC105 and SAC305

Electronics Forum | Wed Jul 02 08:30:32 EDT 2008 | interflux_electronics

Why not follow SAC305? you would do so for any other component finish wouldn't you? A component finish of pure Sn would also not call for a pure Sn profile, would it?

Technical Library: sac105 profile (14)

HALT Testing of Backward Soldered BGAs on a Military Product

Technical Library | 2015-11-19 18:15:07.0

The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.

Lockheed Martin Corporation

Head-in-Pillow BGA Defects

Technical Library | 2009-11-05 11:17:32.0

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.

AIM Solder

Express Newsletter: sac105 profile (401)

SMT Express, Volume 2, Issue No. 9 - from

SMT Express, Volume 2, Issue No. 9 - from Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

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