Industry Directory: sac305 (3)

Qualitek International, Inc.

Qualitek International, Inc.

Industry Directory | Manufacturer of Assembly Material / Soldering

Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified

DKL Metals Ltd

DKL Metals Ltd

Industry Directory | Manufacturer of Assembly Material / Soldering

The UK's largest producer of ultra pure solder alloys for the electronics assembly and HASL industry across Europe.

New SMT Equipment: sac305 (31)

Solder Materials Kits For PCB Circuit Board Hand Soldering

Solder Materials Kits For PCB Circuit Board Hand Soldering

New Equipment | Solder Materials

No-Clean Lead Free Solder SAC 305 or Sn100e Kit Includes: NC611 Wire Solder Dispenser Packs (3) .015", .032" .062" Dia. Flux Core 2.2% No-Clean Rework Flux Pen Solder Iron Tip Tinner PF608 Paste Flux 10cc Syringe w/plunger 22 AWG Needles (2)

Qualitek International, Inc.

New Alloy ECOLLOY - The Future Of High Performance Lead Free Silver Free Solder

New Alloy ECOLLOY - The Future Of High Performance Lead Free Silver Free Solder

New Equipment | Solder Materials

Qualitek International, Inc. presents Ecolloy the future of high performance lead free silver free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu

Qualitek International, Inc.

Electronics Forum: sac305 (429)

SAC 305 Reflow & SN100C Wave and Selective

Electronics Forum | Thu Feb 15 10:48:34 EST 2007 | ck_the_flip

Is there anybody out there doing this scenario: SAC 305 Reflow & SN100C Wave and Selective Can the 2 alloys be mixed on 1 board, say, SAC 305 for SMT, and SN100C for thru-hole? Are 2 different rework chemistries needed, or can one use SN100c wire

SN100C vs. SAC 305 wave soldering

Electronics Forum | Fri Mar 03 13:44:36 EST 2006 | Jon Provost

We switched to Sn100C on 2 waves and kept one with SAC305. The SAC305 will be converted to SN100C as soon as the Aim rep. delivers it next week.

Used SMT Equipment: sac305 (8)

Ersa ECO Select 350

Ersa ECO Select 350

Used SMT Equipment | Soldering - Selective

• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles  • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom

Lewis & Clark

Industry News: sac305 (122)

SMTA Europe Electronics in Harsh Environments Conference Announces Keynote Speaker

Industry News | 2018-03-29 20:48:41.0

SMTA Europe announces Keynote Speaker Ralph Tuttle of Cree, Inc. on High Power LED Solder Joint Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMTA International to Hold Alternate Alloys Sessions

Industry News | 2011-08-30 19:41:37.0

The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

Technical Library: sac305 (120)

Risk Mitigation in Hand Soldering

Technical Library | 2019-01-02 21:51:49.0

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.

Metcal

Electrochemical Methods to Measure the Corrosion Potential of Flux Residues

Technical Library | 2017-07-27 16:51:57.0

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.

KYZEN Corporation

Videos: sac305 (4)

Ecolloy A High Performance Lead Free Silver Free Alloy Alternative

Ecolloy A High Performance Lead Free Silver Free Alloy Alternative

Videos

Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it

Qualitek International, Inc.

ALPHA® XL-825 Cored Solder Wire

ALPHA® XL-825 Cored Solder Wire

Videos

ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.

MacDermid Alpha Electronics Solutions

Events Calendar: sac305 (1)

Understanding the Reality of New, High Reliability Solders

Events Calendar | Thu Feb 25 11:00:00 EST 2016 - Thu Feb 25 14:00:00 EST 2016 | Austin, Texas USA

Understanding the Reality of New, High Reliability Solders

DfR Solutions

Career Center - Resumes: sac305 (2)

Sr. Manufacturing Engineer with over 20 yrs experience

Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production

Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: sac305 (32)

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant

SMTnet Express - October 2, 2014

International Sn3.0Ag0.5Cu (SAC305) is the most popula

Partner Websites: sac305 (26)

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C

Heller Industries Inc.

Semiconductor Packaging - Southwest Systems Technology

| https://www.swsystems.com/product/semiconductor-packaging/

& Equipment SALES CENTERS PRODUCT LINES Industry News Events Contact us Home » Product Lines » Shenmao » Shenmao Products » Semiconductor Packaging Semiconductor Packaging BGA Solder Spheres-SAC305 for PBGA, CBGA, TBGA, CSP and Flip Chip applications


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