Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
No-Clean Lead Free Solder SAC 305 or Sn100e Kit Includes: NC611 Wire Solder Dispenser Packs (3) .015", .032" .062" Dia. Flux Core 2.2% No-Clean Rework Flux Pen Solder Iron Tip Tinner PF608 Paste Flux 10cc Syringe w/plunger 22 AWG Needles (2)
This unique patented alloy has been developed as a lead free alternative for those now using costly SAC alloys and for those switching from lead containing Sn63/Pb37 alloys to the lead free process. SN100e is manufactured from tin, copper, and cobalt
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
WBSHELL12, WBSHELLINNER12, WC12S, WCB12, WCB12PB, WCC12S/BOX, WCE12, WD40 12 OZ, WDP12, WDP12-WELLR, WDPSPK12, WDT12, WDT12A, WDT12A-WELLR, WEE12, WEE12J, WEE12K, WEEVL12 MICROHENRYS, WEH12, WEKI12V, WF12R, WF12S, WG-12 BLK, WG-12 RED, WH-H-12, WH-S-
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Events Calendar | Thu Feb 25 11:00:00 EST 2016 - Thu Feb 25 14:00:00 EST 2016 | Austin, Texas USA
Understanding the Reality of New, High Reliability Solders
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler
adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will
) SnPb 195 205 215 TAL (sec.) 30 60 90 Table 2. Solder Paste, Components, and Board in the Experiment Solder Paste Components & metallization Board metallization SAC305, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100