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Electronics Forum | Mon May 05 09:53:13 EDT 2003 | k_h
Stencil thickness = 175 microns? If my math is correct, 175u=0.175mil, and if that is english units then it is inches. I'm not understanding this correctly, please clarify for my sake please, are you saying the stencil thickness is 0.000175 inches th
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Industry News | 2014-04-07 15:34:11.0
Seika Machinery, Inc., today announced that its 20th anniversary celebration held during the recent IPC APEX EXPO was a huge success.
Industry News | 2016-03-09 15:58:06.0
Nihon Superior is pleased to announce a great turnout for its 50-year anniversary celebration. The event took place at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration began with a sightseeing tour to Kyoto, followed by the anniversary celebration dinner with cask opening ceremony.
Technical Library | ACI Technologies, Inc.
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
Technical Library | 2014-11-28 15:55:13.0
A soldering alloy composition Sn40-Bi60 has been manufactured by quenching method to achieve the both cast and wire shape. Differential scanning calorimetric (DSC) was done to study the melting behavior for a large portion of the alloy melts sharply at a approximately 136 C0 ,the melting point of Sn-Bi. X-Ray diffraction and optical microscopy were used to analyzed its microstructure characterization. The hardness of the alloys has been tested and find at a value 2 HRB as ductile form.
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