Leading manufacturer of Injection Molding Machine such as Direct Hydraulic Clamping Injection Molding Machine, Saving Energy Injection Molding Machine, Vertical Injection Molding Machine.
Industry Directory | Consultant / Service Provider / Manufacturer
Our 100% hungarian owned company is focusing on manufacturing, developing and merchandising novel products using LED technology.
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
Electronics Forum | Thu May 17 10:47:36 EDT 2007 | floydf
My boss posed me an interesting question: would it save energy to leave the wave solder machine on all night instead of turning it off each night? We run 1 shift, and have timers on our machines. My instinct is that it would be cheaper to turn off th
Electronics Forum | Tue Jun 12 08:01:24 EDT 2007 | hussman
So, does turning off your glue gun at nite save energy or should you just leave it on? LOL!
Used SMT Equipment | Soldering - Reflow
TNV25-508EM Feature: · New heat insulation Design with Energy Saving Effect · N2 consumption largely reduced · Air conditioning load also reduced · Power consumption about 40％ reduced · N2 consumption abou
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 125N Parameters Pyramax Specifications Model Pyramax 125N Atmosphere Air or Nitrogen Conveyor Speed 10-60 in/min 25-152 cm/min Conveyor Width 2-18 in 51-457 mm Heated Length 125 in 3175 mm Heated Zones&
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Parts & Supplies | Assembly Accessories
NO. GREASE MODEL PACKAGING 1 Three Bond 2706 Oil & Grease Removing Agent 420ML/PC 10PC/Carton 2 BIRAL T&D spary lubricant 500ML/PC 12PC/Carton 3 BIRAL VG-HT spary lubricant 500ML/PC 12PC/Carton 4 BIRAL BIO-30 high temperature chain oil 1000G
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Parts & Supplies | Pick and Place/Feeders
ZK Electronic Technology Co.,Limited supply JUKI placement machine original parts, JUKI placement machine repair, JUKI Mounter feeder JUKI Mounter nozzles, JUKI Mounter Board Repair, JUKI Mounter Motor Repair, JUKI SMD Laser repair, JUKI placement m
Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
Events Calendar | Wed Oct 25 00:00:00 EDT 2017 - Fri Oct 27 00:00:00 EDT 2017 | Taipei, Taiwan
TPCA Show
Events Calendar | Thu Nov 14 00:00:00 EST 2019 - Fri Nov 15 00:00:00 EST 2019 | Santa Clara, California USA
Printed Electronics USA
Career Center | Strongsville, Ohio USA | Accounting/Finance,Clerical,Engineering,Management,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support
Spartronics is more than just a company. We have great facilities, a dedicated and talented team, tremendous capacity and capabilities, and longstanding customers who need us. Now, it’s all about driving forward with a winning strategy that bui
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Career Center | , | 2013-01-24 13:12:30.0
Write now I am working as a Production Engineer of Mobile Charger and CFL.Assembling of componenens over PCB,Soldreing has to be done under my supervision.
Career Center | Noida, India | Maintenance,Management,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
| https://www.eptac.com/blog/3-ways-iot-is-revolutionizing-the-energy-industry
3 Ways IoT is Revolutionizing the Energy Industry Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2023/04/mk7_brochure_en.pdf
improved sealing and insulation. The Energy Management System on MK7 ovens provides smart control when off-loading of production to further save energy consumption. Level 1: ▪
